Patents
CRT has obtained multiple US and Chinese patents, more patents are under application.
Materials
- Engineered SCD POI Substrate
- Novel Wafer Transfer Technology
- Metal and Piezo material properties
Design
- FBAR on Insulator
- New Filter Topologies and Pre-FAB Modeling
- RF Loss Management via Resonator Features
WLP
- Trench Isolated Cavity
- Organic Bump on Via
- No TSV, No RDL
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